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Global and China PCB (printed circuit board) Industry Report, 2010
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Zahlen und Fakten zur Studie: | 153 seiten | |||||||||
| Inhalt der Studie: |
In 2009, the output value of the global PCB industry reached about US$40.6 billion, down 15.83% over 2008. This was mainly caused by continuously decreasing PCB shipment and average prices. As for mai.....
In 2009, the output value of the global PCB industry reached about US$40.6 billion, down 15.83% over 2008. This was mainly caused by continuously decreasing PCB shipment and average prices. As for main sub-sectors, the output value of the global substrate, rigid PCB and flexible printed circuit (FPC) board sectors descended by 50%, 20% and 3.8% respectively compared with 2008. The decline of the global substrate and rigid PCB sectors is mainly due to the sharp drop of sales volume of desktops and medium to high-end notebooks. In comparison, the global FPC board sector declined more slightly in 2009, thanks to the growing number of LED backlight modules and Smart Phone FPC boards as well as the touch panel boom. From 2000 to 2009, in terms of output value, computer, communications, industrial/medical, military and automotive PCBs decreased by 3%, 13.5%, 20.5%, 20.1% and 26.8% respectively, while consumer electronics PCB and package substrate increased by 15.8% and 68% respectively. Single-sided/double-sided PCB and multilayer PCB decreased by 37.3% and 25.2% respectively, while high-density interconnect (HDI) board, package substrate and FPC increased by 163.1%, 68.1% and 90.0% respectively. In 2009, from the perspective of the global PCB distribution pattern, Mainland China, Japan and Taiwan were still the main production areas, South Korea continued to expand its PCB industry, while Europe and the United States were in recession. Compared with Japan and South Korea with advantages in high-end products such as IC substrate and FPC board, and Taiwan with advantages in mobile phone PCB, China, mainly engaged in single-sided PCB and multilayer PCB, is inferior in terms of the technical content of the PCB industry. In 2009, China's PCB industry for the first time saw its output value decline slightly by 3.6% to US$16.35 billion. Nevertheless, its share in the global PCB output value continued to rise. Among China's top 100 PCB enterprises in terms of sales revenue, local ones performed well, for example, the sales revenue of Bomin Electronic rose by 150.7% over 2008. Report Highlights [Studien Infos ausblenden] |
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1. Application of PCB 1.1 Mobile Phone PCB Industry 1.2 PCB for Memory Module 1.3 PCB for Photovoltaic Panel 1.4 PCB for Notebook and DV 1.5 PCB for Automobile Electronics 2. PCB Industry 2.1 PCB Industry Chain 2.2 PCB Industry Review in 2009 and Outlook in 2010 2.3 Technology Pattern of PCB Industry 2.4 Geographical Pattern of PCB Industry 2.5 PCB Industry in Taiwan 2.6 PCB Industry in Mainland China 2.7 FPC Market Scale 2.8 FPC Industry Chain 2.9 Geographical Distribution of FPC Industry 2.10 Relationship between FPC Customers and Suppliers 2.11 Ranking in FPC Industry 2.12 Ranking in PCB Industry 3. Typical PCB Manufacturers 3.1 Samsung Electro 3.2 AT&S 3.3 Guangdong Goworld Co., Ltd 3.3.1 Profile and Operation 3.3.2 Business Development Advantages 3.3.3 Development Trends, 2010 3.4 Aspocomp 3.5 Founder PCB 3.6 Meiko Electronics Co., Ltd 3.7 Meadville Group 3.8 Unimicron 3.9 COMPEQ MANUFACTURING CO., LTD 3.10 Unitech 3.11 WUS Printed Co., Ltd 3.12 GOLD CIRCUIT ELECTRONICS LTD 3.13 Chin Poon Industrial Co., Ltd 3.14 Tripod Technology Corporation 3.15 PLOTECH TECHNOLOGY 3.16 HannStar Board Co., Ltd 3.17 Tianjin Printronics Circuit Corp 3.18 Kingboard Chemical Holdings Ltd 3.19 DYnamic Electronics Cp., Ltd 3.20 TAIWAN PCB TECHVEST CO.,LTD 3.21 Viasystems Group Inc 3.22 Daisho Microline Limited 3.23 IBIDEN CO.,LTD [Inhaltsverzeichnis ausblenden] |
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Technology Trends of Mobile Phone PCB Mobile Phone PCB Suppliers of Apple, 2009 Mobile Phone PCB Suppliers of RIM, 2009 Mobile Phone PCB Suppliers of Nokia, 2006,2009 Mobile Phone PCB Suppliers of Samsung, 2006,2009 Mobile Phone PCB Suppliers of LG, 2006,2009 PCB Suppliers of Major Mobile Phone Manufacturers Market Shares of Mobile Phone PCB Manufacturers by Revenue, 2009 Market Shares of Major Memory PCB Suppliers, 2006,2009 Market Shares of Major Photovoltaic Panel Manufacturers in Taiwan, 2006, 2009 Technical Roadmap of Notebook PCB Market Shares of Major Notebook PCB Manufacturers in the World, 2006, 2009 Cost Structure of CCL Industry and PCB Industry Global PCB Output Value, 1997-2009 Global PCB Shipment and Average Price, 1999-2009 Global PCB Output Value, 1997-2011 Global PCB Downstream Application, 2000, 2009 Global PCB Product Structure, 2000, 2009 Geographic Distribution of Global PCB Output Value, 2006-2011 PCB Output Value of Taiwan, 2007-2012 Distribution of Taiwan’s PCB Output Value by Region, 2008-2010 Distribution of Taiwan’s PCB Output Value by Technology, 2009 PCB Market Scale in Mainland China, 2007-2012 Geographic Distribution of PCB Industry in Mainland China by Output Value, 2008-2010 PCB Market Segments in Mainland China, 2008-2010 PCB Downstream Applications in Mainland China, 2008-2010 FPC Market Scale, 2007-2013 Downstream Distribution of FPC Market, 2007-2013 FPC Industry Chain in Taiwan Geographic Distribution of FPC Industry (by Location of Corporate Headquarters), 2009 Geographic Distribution of FPC Industry (by Place of Production), 2009 Ranking of FPC Manufacturers in Japan Ranking of FPC Manufacturers in South Korea Ranking of FPC Manufacturers in Taiwan Ranking of FPC Manufacturers in Mainland China and Hong Kong Top 20 PCB Manufacturers in the World by Income, 2004-2008 Ranking of Top 18 PCB Manufacturers in the World, 2009 Ranking of Top 20 PCB Manufacturers in Taiwan, 2009 Sales and Gross Profit of Samsung Electro-Mechanics, 2009-Q1 2010 Revenue Structure of Samsung Electro-Mechanics by Division, Q1 2010 Revenue Structure of ACI Division of Samsung Electro-Mechanics, Q1 2010 Revenue Structure of LCR Division of Samsung Electro-Mechanics, Q1 2010 Revenue Structure of OMS Division of Samsung Electro-Mechanics, Q1 2010 Revenue Structure of CDS Division of Samsung Electro-Mechanics, Q1 2010 Financial Data of AT&S, Q4 2009 Revenue of AT&S by Division, FY2006-FY2009 Revenue of AT&S by Region, FY2008-FY2009 Business Performance of AT&S in Austria, FY2008-FY2009 Business Performance of AT&S in Asia-Pacific, FY2008-FY2009 Operating Income of Goworld, 2007-2009 Quarterly Net Profit of Goworld, 2007-2009 Revenue of Goworld by Product and by Region, 2009 Operating Income and Gross Profit of Aspocomp, Q4 2008-Q4 2009 Organizational Structure of Founder’s PCB Industry Founder’s PCB Industry Layout Specifications of Founder’s PCB HDI Specifications of Founder’s PCB Backplane & Line Card Specifications of Founder’s PCB Backplane & Line Card Specifications of Founder’s Gold Finger PCBs Specifications of Founder’s PCB Substrate Development of Meiko Global Business Scope of Meiko Electronics Revenue and Gross Profit of Meiko Electronics, Q4 2008- Q4 2009 Revenue of Meiko Electronics by Region, Q3 2009 Revenue of Meiko Electronics by Application, Q2-Q3 2009 PCB Revenue of Meiko Electronics by Layer Count, Q2-Q3 2009 Meadville Group Technology Roadmap for Conventional PCB Meadville Group Technology Roadmap for HDI PCB Meadville Group Technology Roadmap for IC Substrate Financial Data of Meadville Group, H1 2009 Meadville Group Revenue by Layer Count, 2004-2008 Meadville Group Revenue by Application, 2004-2008 Unimicron’s Revenue, 1990-2009 Unimicron’s Profit Margin, 1995-Q1 2009 Unimicron’s Position in the World Unimicron’s Organizational Structure Unimicron’s Technology Roadmap Operating Income of Unimicron by Product, 2009 Unimicron’s Plants Production Capacity of Unimicron by Product, 2006-end of 2009 Application of Unimicron’s Products, 2007-2009 COMPEQ General Capabilities Product Types COMPEQ HDI Product Types COMPEQ High Layer Count / Regular Product Types COMPEQ Rigid-Flex Product Types COMPEQ Flex Product Types Revenue and Gross Profit of COMPEQ, 2004-2008 COMPEQ Branches Worldwide Application of COMPEQ’s Products, 2004-2008 Output Value and Output of COMPEQ, 2007-2008 Sales Volume and Sales Revenue of COMPEQ, 2007-2008 R&D Investment of COMPEQ, 2004-Q1 2009 COMPEQ Employees in Taiwan Roadmap for Unitech’s Mobile Phone Technology Roadmap for Unitech’s Rigid-Flex Technology Revenue and Net Profit of Unitech, 2007-2009 Monthly Operating Income of Unitech, 2008-2010 Operating Income of Unitech by Product (by Layer Count), 2008 Sales Revenue of Unitech by Region, 2006-2008 WUS Capabilities of HDI WUS Capabilities of RF Module WUS Capabilities of Multi-Layer Revenue and Gross Profit Margin of WUS, 2004-2009 Income Statement of GCE, 2005-Q3 2009 Sales Revenue of GCE by Product, Q1 2009 Sales of GCE’s Products by Region Equipment of GCE Production Capacity of GCE Monthly Revenue of Chin Poon, 2008-2010 Organizational Structure of Chin Poon Revenue of Chin Poon by Region, 2006-2008 Production Capacity of Chin Poon by Plant (by Layer), 2009 PCB Output Value of Chin Poon by Application, 2007-2009 Sales Volume and Revenue of Main Products of Chin Poon, 2007-2008 Monthly Revenue of Tripod Technology, 2007-2009 Production Capacity Planning of Tripod Technology, 2009 Application of Products of Tripod Technology, 2009 Products of Tripod Technology by Layer Count, 2009 Revenue and Gross Profit of PLOTECH, 2004-2009 PLOTECH Production Capabilities HDI Capability and Roadmap of HannStar Board Multi-Layer Board Capability and Roadmap of HannStar Board Application of Products of HannStar Board, Q1 2010 Revenue and Gross Profit of HannStar Board, 2005-2009 Monthly Net Operating Income of HannStar Board, 2009-2010 HannStar Board’s Total Capacity, 2006-2010 TPC’s Production Process and Standard Capability Operating Income and Gross Profit of TPC, 2008-2010 Organizational Structure of TPC Product Categories of TPC, 2006-H1 2009 Revenue and Gross Profit of Kingboard, 2006-2009 Profit Structure of Kingboard, 2009 PCB Revenue of Elec & Eltek by Region, 2008-2009 PCB Revenue of Elec & Eltek by Layer Count, 2008 PCB Revenue of Elec & Eltek by Layer Count, 2009 Dynamic’s Organizational Structure Dynamic’s Production Bases Dynamic’s Revenue, 2001-2009 Production Capacity Expansion Plan of Dynamic, 2009-2012 Production Capacity Expansion Plan of Dynamic Taiwan, 2009-2012 Production Capacity Expansion Plan of Dynamic Kunshan, 2009-2012 Production Capacity Expansion Plan of Dynamic Xiamen, 2009-2012 Application of Dynamic’s Products, 2008-Q1 2009 R&D Roadmap of Dynamic Roadmap for Production Capacity of Dynamic Regional Distribution of TPT's Business Network Major Clients of TPT Monthly Operating Income and Growth Rate of TPT, 2007-2009 Operating Income of TPT by Product Application of TPT’s Products Production Capacity Planning of TPT, 2007-2009 Capital Expenditure and Production Capacity of TPT, 2005-2009 Viasystems’PCB Technology Roadmap for Capabilities and Processes Operating Income and Profit of Viasystems, 2005-2009 Revenue of Viasystems by Region, 2007-2009 Application of Products of Viasystems, 2007-2009 Revenue of Viasystems by Application, 2008-2009 Major Clients of Viasystems by Revenue, 2009 Operating Income of Daisho Microline, FY2007-FY2009 Operating Income of Daisho Microline by Region, 2008-Q2, Q3 2009 Revenue of IBIDEN, FY2005-FY2009 R&D Investment of IBIDEN, FY2006-FY2010 Revenue of IBIDEN by Region, FY2009 Sales of IBIDEN by Segment, FY2008 Operating Income of CMK, FY2007-FY2009 Revenue of CMK (by Product), 2008-2009 Revenue of CMK (by Region), 2008-2009 Revenue of CMK (by Application), 2008-2009 Bases of CMK in China Sales Revenue of CMK (Wuxi), 2002-2008 Output of CMK (Wuxi), 2002-2008 Application of CMK (Wuxi)’s Products, 2008 Main Products of CMK (Wuxi) (by Layer) [Tabellenverzeichnis ausblenden] |
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